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5000 Arkusz danych(PDF) 91 Page - Intel Corporation |
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5000 Arkusz danych(HTML) 91 Page - Intel Corporation |
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91 / 104 page ![]() Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 91 Boxed Processor Specifications 8.2.1 Boxed Processor Heat Sink Dimensions (CEK) The boxed processor will be shipped with an unattached thermal solution. Clearance is required around the thermal solution to ensure unimpeded airflow for proper cooling. The physical space requirements and dimensions for the boxed processor and assembled heat sink are shown in Figure 8-4 through Figure 8-8. Figure 8-9 through Figure 8-10 are the mechanical drawings for the 4-pin board fan header and 4-pin connector used for the active CEK fan heat sink solution. |
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