SIZE

CODE IDENT NO.

UNSPECIFIED TOLERANCES

DWG NO.

REV.

SHEET

A

00136

N/A

DOC200103

C

5

by design similarity. A copy of the parts list and materials can be provided for customer

review upon request.

4.1.3.1 Class B Microcircuits. When specified, microcircuits assembled into Pedigree Codes B and C

devices (¶ 5.2a) are procured from wafer lots that have passed MIL-PRF-55310 element

evaluations for Class B devices.

4.1.4

Packages. Packages are procured that meet the construction, lead materials and finishes as

specified in MIL-PRF-55310. Package lots are upscreened in accordance with the

requirements of MIL-PRF-38534 as applicable.

4.1.5

Traceability. Class S active device lots are homogenous and traceable to the manufacturer’s

individual wafer. Swept Quartz Crystals are traceable to the quartz bar and the processing

details of the autoclave lot, as applicable. All other elements and materials are traceable to

their incoming inspection lots. Manufacturing lot and date code information shall be recorded,

by TCXO serial number, of every component and all materials used in the manufacture of that

TCXO. All semiconductors used in the manufacture of a given production lot of TCXOs shall

be from the same wafer and have the same manufacturing lot date code. A production lot, as

defined by Vectron, is all oscillators that have been kitted and assembled as a single group.

After the initial kitting and assembly, this production lot may be divided into multiple sublots

to facilitate alignment and test capacity and may be sealed at multiple times within a 13 week

window.

4.2

Mechanical.

4.2.1

Package Outline. Table 1 links each Hi-Rel Standard Model Number of this specification to a

corresponding package style. Mechanical Outline information of each package style is found

in the referenced Figure.

4.2.2

any one given semiconductor die will vary, but the combined average for all active devices

semiconductor is 2°C to 4°C. With the oscillator operating at +125°C, the average junction

temperature is approximately +129°C and under no circumstance will it ever exceed the

maximum manufacturer’s rated junction temperature of +150°C.

4.3

Electrical.

4.3.1

Input Power. CMOS devices are designed for 3.3 or 5.0 volt dc operation, ±5%. Sinewave

devices are designed for 5.0, 12.0 or 15.0 volt dc operation, ±5%.

4.3.2

Temperature Range. Operating range is IAW the chosen temperature stability code.

4.3.3

Frequency Tolerance. Temperature stability includes initial accuracy at +25°C (with EFC),

load ±10% and supply ±5%. All devices include an EFC pin and the external frequency