SIZE

CODE IDENT NO.

UNSPECIFIED TOLERANCES

DWG NO.

REV.

SHEET

A

00136

N/A

DOC200103

C

7

(X) Engineering Model (EM)

(Z) Commercial Model (CM)

5.2

Optional Design, Test and Data Parameters. The following is a list of design, assembly,

inspection and test options that can be selected or added by purchase order request.

a. Design Pedigree (choose one as the 5

(E) Class S components, Enhanced Element Evaluation, Swept Quartz

(R) Class S components, Swept Quartz

(B) Class B components, Swept Quartz

(C) Class B components, Cultured Quartz

(D) COTS components, Cultured Quartz

b. Input Voltage as the 15

c. Frequency-Temperature Slew Test

d. Radiographic Inspection

e. Group C Inspection: MIL-PRF-55310 (requires 8 pc. sample)

f. Group C Inspection: MIL-PRF-38534 (requires 8 pc. sample – 5 pc. Life, 3 pc. RGA)

g. Internal Water-Vapor Content (RGA) samples and test performance

h. MTBF Reliability Calculations

i. Worst Case/Derating Analysis

j. Deliverable Process Identification Documentation (PID)

k. Customer Source Inspection (pre-cap / final)

5.3

Test Conditions. Unless otherwise stated herein, inspections are performed in accordance with

those specified in MIL-PRF-55310. Process travelers identify the applicable methods,

conditions and procedures to be used. Examples of electrical test procedures that correspond to

MIL-PRF-55310 requirements are shown in Table 3.

5.4

Deliverable Data. The manufacturer supplies the following data, as a minimum, with each lot

of devices:

a. Completed assembly and screening lot travelers, including rework history.

b. Electrical test variables data, identified by unique serial number.

c. Frequency-Temperature Slew plots, Radiographic data, Group C data and RGA data as

required by purchase order.

5.5

Discrepant Material. All MRB authority resides with the procuring activity.

5.6

Failure Analysis. Any catastrophic failure (no output, no input current) at Post Burn-In or after

will be evaluated for root cause. The customer will be notified after occurrence and upon

completion of the evaluation.

6.

PREPARATION FOR DELIVERY

6.1

Packaging. Devices will be packaged in a manner that prevents handling and transit damage

during shipping. Devices will be handled in accordance with MIL-STD-1686 for Class 1

devices.