MCP2021 datasheet(38/52 Pages) MICROCHIP

38 / 52 page

MCP2021/2/1P/2P

DS22018F-page 38

8-Lead Plastic Dual Flat, No Lead Package (MF) – 6x5 mm Body [DFN-S]

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Package may have one or more exposed tie bars at ends.

3. Package is saw singulated.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Note:

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units

MILLIMETERS

Dimension Limits

MIN

NOM

MAX

Number of Pins

Pitch

1.27 BSC

Overall Height

0.80

0.85

1.00

Standoff

0.00

0.01

0.05

Contact Thickness

0.20 REF

Overall Length

5.00 BSC

Overall Width

6.00 BSC

Exposed Pad Length

3.90

4.00

4.10

Exposed Pad Width

2.20

2.30

2.40

Contact Width

0.35

0.40

0.48

Contact Length

0.50

0.60

0.75

Contact-to-Exposed Pad

0.20

–

NOTE 2

NOTE 1

EXPOSED PAD

NOTE 1

BOTTOM VIEW

TOP VIEW

Microchip Technology Drawing C04-122B

MCP2021 Arkusz danych(PDF) 38 Page - Microchip Technology

MCP2021 Arkusz danych(HTML) 38 Page - Microchip Technology

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52

Arkusz danych Pobierz

Link URL