MHW932

4

MOTOROLA RF DEVICE DATA

APPLICATIONS INFORMATION

NOMINAL OPERATION

All electrical specifications are based on the nominal

conditions of Vs1 = Vs2 = Vs3 = Vs4 = 12.5 Vdc (Pins 2, 3,

5, 6), and Vb = 5.0 Vdc (Pin 4). With these conditions, maxi-

mum current density on any device is 1.5 x 105 A/cm2 and

maximum die temperature is 165

°C. While the modules are

designed to have excess gain margin with ruggedness, op-

eration of these units outside the published specifications is

not recommended unless prior communications regarding in-

tended use have been made with the factory representative.

GAIN CONTROL

The module output power should be limited to specified

value. The preferred method of power control is to fix Vs1 =

Vs2 = Vs3 = Vs4 = 12.5 Vdc (Pins 2, 3, 5, 6), Vb = 5.0 Vdc (Pin

4), and vary Pin (Pin 1) from 0 to 100 mW.

DECOUPLING

Due to the high gain of the four stages and the module size

limitation, external decoupling networks require careful con-

sideration, Pins 2, 3, 4, 5, and 6 are internally bypassed with

a 0.018

µF chip capacitor which is effective for frequencies

from 5.0 MHz through 940 MHz. For bypassing frequencies

below 5.0 MHz, networks equivalent to that shown in Figure

1 are recommended. Inadequate decoupling will result in

spurious outputs at certain operating frequencies and certain

phase angles of input and output VSWR.

LOAD MISMATCH

During final test each module is load mismatch tested in a

fixture having the identical decoupling networks described in

Figure 1. Electrical conditions are Vs1 = Vs2 = Vs3 = Vs4 =

15.6 Vdc (Pins 2, 3, 5, 6), and Vb = 5.0 Vdc (Pin 4), VSWR

equal to 10:1, and output power equal to 40 watts.