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ADT7420UCPZ-R2 Arkusz danych(PDF) 6 Page - Analog Devices |
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ADT7420UCPZ-R2 Arkusz danych(HTML) 6 Page - Analog Devices |
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6 / 24 page ![]() ADT7420 Data Sheet Rev. 0 | Page 6 of 24 ABSOLUTE MAXIMUM RATINGS Table 3. Parameter Rating VDD to GND −0.3 V to +7 V SDA Voltage to GND −0.3 V to VDD + 0.3 V SCL Output Voltage to GND −0.3 V to VDD + 0.3 V A0 Input Voltage to GND −0.3 V to VDD + 0.3 V A1 Input Voltage to GND −0.3 V to VDD + 0.3 V CT and INT Output Voltage to GND −0.3 V to VDD + 0.3 V ESD Rating (Human Body Model) 2.0 kV Operating Temperature Range1 −40°C to +150°C Storage Temperature Range −65°C to +160°C Maximum Junction Temperature, TJMAX 150°C 16-Lead LFCSP (CP-16-17) Power Dissipation2 WMAX = (TJMAX − TA3)/θJA Thermal Impedance4 θJA, Junction-to-Ambient (Still Air) 37°C/W θJC, Junction-to-Case 33°C/W IR Reflow Soldering 220°C Peak Temperature (RoHS-Compliant Package) 260°C (+0°C/−5°C) Time at Peak Temperature 20 sec to 40 sec Ramp-Up Rate 3°C/sec maximum Ramp-Down Rate −6°C/sec maximum Time from 25°C to Peak Temperature 8 minutes maximum 1 Sustained operation above 125°C results in a shorter product lifetime. For more information, contact Analog Devices. 2 Values relate to package being used on a standard 2-layer PCB. This gives a worst-case θJA and θJC. 3 TA = ambient temperature. 4 Junction-to-case resistance is applicable to components featuring a preferential flow direction, for example, components mounted on a heat sink. Junction-to-ambient is more useful for air-cooled, PCB-mounted components. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ESD CAUTION |
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