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MPC8250 Arkusz danych(PDF) 56 Page - Freescale Semiconductor, Inc |
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MPC8250 Arkusz danych(HTML) 56 Page - Freescale Semiconductor, Inc |
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56 / 62 page ![]() MPC8250 Hardware Specifications, Rev. 2 56 Freescale Semiconductor Package Description 5.1 Package Parameters Package parameters are provided in Table 23. 5.2 Mechanical Dimensions This section discusses the TBGA and PBGA package dimensions. Table 23. Package Parameters Package Devices Outline (mm) Type Interconnects Pitch (mm) Nominal Unmounted Height (mm) ZU MPC8250 37.5 × 37.5 TBGA 480 1.27 1.55 VV TBGA (Pb free) ZO 27 × 27 PBGA 516 1 2.25 VR PBGA (Pb free) |
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