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MPC8250 Arkusz danych(PDF) 57 Page - Freescale Semiconductor, Inc |
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MPC8250 Arkusz danych(HTML) 57 Page - Freescale Semiconductor, Inc |
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57 / 62 page ![]() MPC8250 Hardware Specifications, Rev. 2 Freescale Semiconductor 57 Package Description 5.2.1 TBGA Package Dimensions Figure 17 provides the mechanical dimensions and bottom surface nomenclature of the 480 TBGA package. Figure 17. Mechanical Dimensions and Bottom Surface Nomenclature—480 TBGA Dim Millimeters Min Max A 1.45 1.65 A1 0.60 0.70 A2 0.85 0.95 A3 0.25 — b 0.65 0.85 D 37.50 BSC D1 35.56 REF e 1.27 BSC E 37.50 BSC E1 35.56 REF Notes: 1. Dimensions and Tolerancing per ASME Y14.5M-1994. 2. Dimensions in millimeters. 3. Dimension b is measured at the |
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