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STM32F050C4 Arkusz danych(PDF) 87 Page - STMicroelectronics

Numer części STM32F050C4
Szczegółowy opis  Low- and medium-density advanced ARM-based 32-bit MCU with up to 32 Kbytes Flash, timers, ADC and comm. interfaces
PDF  97 Pages
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Producent  STMICROELECTRONICS [STMicroelectronics]
Strona internetowa  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32F050C4 Arkusz danych(HTML) 87 Page - STMicroelectronics

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STM32F050xx
Package characteristics
Doc ID 023683 Rev 1
87/97
Figure 34.
UFQFPN32 - 5 x 5 mm, 32-lead ultra thin fine pitch quad flat no-lead package outline
1.
Drawing is not to scale.
2.
All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
3.
There is an exposed die pad on the underside of the UFQFPN package. This pad is used for the device ground and must
be connected. It is referred to as pin 0 in Table 8: Pin definitions.
Seating plane
ddd
C
C
A3
A1
A
D
e
9
16
17
24
32
Pin # 1 ID
R = 0.30
8
E
L
L
D2
1
b
E2
A0B8_ME
Bottom view
Table 62.
UFQFPN32 – 5 x 5 mm, 32-lead ultra thin fine pitch quad flat no-lead package
mechanical data
Dim.
millimeters
inches(1)
Min
Typ
Max
Min
Typ
Max
A
0.5
0.55
0.6
0.0197
0.0217
0.0236
A1
0.00
0.02
0.05
0
0.0008
0.0020
A3
0.152
0.006
b
0.18
0.23
0.28
0.0071
0.0091
0.0110
D
4.90
5.00
5.10
0.1929
0.1969
0.2008
D2
3.50
0.1378
E
4.90
5.00
5.10
0.1929
0.1969
0.2008
E2
3.40
3.50
3.60
0.1339
0.1378
0.1417
e
0.500
0.0197
L
0.30
0.40
0.50
0.0118
0.0157
0.0197
ddd
0.08
0.0031
1.
Values in inches are converted from mm and rounded to 4 decimal digits.



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