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RC2012 Arkusz danych(PDF) 3 Page - Samsung semiconductor |
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RC2012 Arkusz danych(HTML) 3 Page - Samsung semiconductor |
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3 / 40 page ![]() Operation Notes Example of land Pattern Design Recommended Soldering Conditions General Structure General Precision Jumper Low ohms (RC Series) Low ohms (RUT Series) Ultra Low Ohms (RU Series) Ultra Low Ohms (RUK Series) Ultra Low Ohms (RUW Series) Arrays (CONVEX Type) Arrays (CONCAVE Type) Arrays (FLAT Type) Arrays for Memory Modules Attenuator Characteristics Performance Packaging Standard Resistance Value CONTENTS Operation Notes Example of Land Pattern Design Recommended Soldering Conditions General Structure General Precision Jumper Low ohms(RC Series) Low ohms(RUT Series) Ultra Low Ohms(RU Series) Ultra Low Ohms(RUK Series) Ultra Low Ohms(RUW Series) Arrays(CONVEX Type) Arrays(CONCAVE Type) Arrays(FLAT Type) Arrays for Memory Modules Attenuator Characteristics Performance Packaging Standard Resistance Value 4 5 6 8 7 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 |
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