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PTH12050W/L

SLTS214H – MAY 2003 – REVISED OCTOBER 2007

EFFICIENCY

OUTPUT RIPPLE

POWER DISSIPATION

vs

vs

vs

LOAD CURRENT

LOAD CURRENT

LOAD CURRENT

Figure 6.

Figure 7.

Figure 8.

TEMPERATURE DERATING

vs

OUTPUT CURRENT

Figure 9.

(1)

Characteristic data has been developed from actual products tested at 25

°C. This data is considered typical data for the converter.

Applies to Figure 6, Figure 7, and Figure 8.

(2)

SOA graphs represent the conditions at which internal components are at or below the manufacturer's maximum operating

temperatures. Derating limits apply to modules soldered directly to a 4 inches

× 4 inches double-sided PCB with 1-oz. copper. For

surface mount packages (AS and AZ suffix), multiple vias (plated through holes) are required to add thermal paths around the power

pins. Please refer to the mechanical specification for more information. Applies to Figure 9.

Copyright © 2003–2007, Texas Instruments Incorporated

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