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Revision 1.12

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AS1312

Datasheet - A b s o l u t e M a x i m u m R a t i n g s

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of

the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 4 is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Min

Max

Units

Comments

Electrical Parameters

VIN, VOUT, EN, LBI, LBO to GND

-0.3

+7

V

LX, REF to GND

-0.3

V

Input Current (latch-up immunity)

-100

100

mA

Norm: JEDEC 78

Electrostatic Discharge

Electrostatic Discharge HBM

±2

kV

Norm: MIL 883 E method 3015

Temperature Ranges and Storage Conditions

Thermal Resistance

TDFN

60

ºC/W

Junction-to-ambient thermal resistance is very

dependent on application and board-layout. In

situations where high maximum power dissipation

exists, special attention must be paid to thermal

dissipation during board design.

WL-CSP

97

Junction Temperature

+125

ºC

Storage Temperature Range

-55

+150

ºC

for 8-pin (2x2) TDFN

-55

+125

ºC

for 8-pin WL-CSP

Package Body Temperature

+260

ºC

The reflow peak soldering temperature (body

temperature) specified is in accordance with IPC/

JEDEC J-STD-020“Moisture/Reflow Sensitivity

Classification for Non-Hermetic Solid State Surface

Mount Devices”.

The lead finish for Pb-free leaded packages is matte

tin (100% Sn).

Humidity non-condensing

5

85

%

Moisture Sensitive Level

1

Represents a maximum floor life time of unlimited