TSL1401CS−LF

128 × 1 LINEAR SENSOR ARRAY WITH HOLD

TAOS072E − APRIL 2007

12

r

r

Copyright E 2007, TAOS Inc.

The LUMENOLOGY r Company

www.taosinc.com

MECHANICAL INFORMATION

The TSL1401CS-LF is available in a solder bump linear array package, ready for surface mount manufacturing

processes.

SOLDER BUMP LINEAR ARRAY

Pin 1 SI

Pin 2 HOLD

Pin 3 CLK

Pin 4 GND

Pin 5 GND

Pin 6 AO

Pin 7 SO

8120

8870 + 25

TOP VIEW

SIDE VIEW

Pixel 1

Pixel 128

645 + 55

8

Alignment Marker (Pin 8)

1000 + 25

BOTTOM

VIEW

935 + 30

7

4

4

127

128

375 + 25

A

B

128

430.4 + 25

DETAIL A

DETAIL B

505 Typ

Lead Free

Pb

300 + 30

400 + 50

Glass Cover Thickness

NOTES: A. All linear dimensions are in micrometers. Dimension tolerance is ± 10 μm unless otherwise noted.

B. Solder bumps are formed of Sn (96.5%), Ag (3%), and Cu (0.5%).

C. The top of the photodiode active area is 415 μm below the glass that forms the top surface of the package. The index of

refraction of the glass is 1.52.

D. This drawing is subject to change without notice.

Figure 12. TSL1401CS−LF Solder Bump Linear Array Package