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TSL1401CS Arkusz danych(PDF) 16 Page - ams AG |
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TSL1401CS Arkusz danych(HTML) 16 Page - ams AG |
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16 / 19 page ![]() TSL1401CS−LF 128 × 1 LINEAR SENSOR ARRAY WITH HOLD TAOS072E − APRIL 2007 15 The LUMENOLOGY r Company r r Copyright E 2007, TAOS Inc. www.taosinc.com MANUFACTURING INFORMATION t3 t2 t1 tsoak T3 T2 T1 Tpeak Not to scale — for reference only Time (sec) Figure 14. TSL1401CS−LF Solder Bump Linear Array Package Solder Profile It is important to use a substrate that has an immersion plating surface. This may be immersion gold, silver, or white tin. Hot air solder leveled substrates (HASL) are not coplanar and should not be used. Qualified Equipment D EKRA E5 — Stencil Printer D ASYMTEC Century — Dispensing system D SIEMENS F5 — Placement system − SIEMENS 912 — Vacuum Pickup Tool Nozzle D VITRONICS 820 — Oven D PHOENIX — Inspector X-Ray system Qualified Materials D OMG — Microbond solder paste D Loctite 3621 — Adhesive |
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