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PM0237 Arkusz danych(PDF) 8 Page - STMicroelectronics

Numer części PM0237
Szczegółowy opis  The main purpose of this document is to provide a developer
PDF  88 Pages
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Producent  STMICROELECTRONICS [STMicroelectronics]
Strona internetowa  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

PM0237 Arkusz danych(HTML) 8 Page - STMicroelectronics

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Bluetooth low energy technology
PM0237
8/88
DocID027104 Rev 2
1.1
BLE stack architecture
Bluetooth low energy technology has been formally adopted by the Bluetooth Core
Specification version 4.0 (on Section 4: References). This version of the Bluetooth standard
supports two systems of wireless technology:
•
Basic rate
•
Bluetooth low energy
Bluetooth low energy technology operates in the unlicensed industrial, scientific and
medical (ISM) band at 2.4 to 2.485 GHz, which is available and unlicensed in most
countries. It uses a spread spectrum, frequency hopping, full-duplex signal. Key features of
Bluetooth low energy technology are:
•
robustness
•
performance
•
reliability
•
interoperability
•
low data rate
•
low-power
In particular, Bluetooth low energy technology has been created for the purpose of
transmitting very small packets of data at a time, while consuming significantly less power
than Basic Rate/Enhanced Data Rate/High Speed (BR/EDR/HS) devices.
The Bluetooth low energy technology is designed for addressing two alternative
implementations:
•
Smart device
•
Smart Ready device
Smart devices support only support the BLE standard. It is used for applications in which
low power consumption and coin cell battery is the key point (as sensors).
Smart Ready devices support both BR/EDR/HS and BLE standards (typically a mobile or a
laptop device).
The Bluetooth low energy stack consists of two components:
•
Controller
•
Host
The Controller includes the Physical Layer and the Link Layer.
The Host includes the Logical Link Control and Adaptation Protocol (L2CAP), the Security
Manager (SM), the Attribute protocol (ATT), Generic Attribute Profile (GATT) and the
Generic Access Profile (GAP). The interface between the two components is called Host
Controller Interface (HCI).



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