| Zakładka z wyszukiwarką danych komponentów |
|
PM0237 Arkusz danych(PDF) 30 Page - STMicroelectronics |
|
|
|||||||||||||||||||||||||||||
PM0237 Arkusz danych(HTML) 30 Page - STMicroelectronics |
|
30 / 88 page ![]() Bluetooth low energy technology PM0237 30/88 DocID027104 Rev 2 For a detailed description of the GAP procedures, refer to the Bluetooth specification v4.0. Table 27. GAP bonding procedures Procedure Description Notes Role Bonding procedure Starts the pairing process with the bonding bit set on the pairing request. Central |
|
Link URL |
| Czy Alldatasheet okazała się pomocna? [ DONATE ] |
O Alldatasheet | Reklama | Kontakt | Polityka prywatności | Link do karty katalogowej | Linki | Lista producentów All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |