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LC898201 Arkusz danych(PDF) 3 Page - ON Semiconductor |
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LC898201 Arkusz danych(HTML) 3 Page - ON Semiconductor |
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3 / 16 page ![]() LC898201 No.A2319-3/16 Package Dimensions unit : mm [ LC898201RA-NH ] FBGA64 6x6 CASE 113BL ISSUE O SEATING PLANE 0.20 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER PARALLEL TO DATUM C. 4. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. 5. DIMENSION C, THE SEATING PLANE, IS DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS. 2X DIM A MIN MAX −−− MILLIMETERS A1 D 6.00 BSC E b 0.24 0.34 e 0.50 BSC 1.05 D E A B PIN A1 REFERENCE e 0.10 C 64X b 45 C B A 0.20 C A1 A C 0.05 0.15 6.00 BSC 0.28 64X DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* 0.50 0.50 0.20 C 2X TOP VIEW SIDE VIEW BOTTOM VIEW NOTE 4 e RECOMMENDED 12 3 PITCH D E PITCH A1 H G F J K 910 678 NOTE 5 e/2 e/2 A M 0.08 B C NOTE 3 INDEX MARK |
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