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MPC8264AVR Arkusz danych(PDF) 44 Page - Motorola, Inc |
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MPC8264AVR Arkusz danych(HTML) 44 Page - Motorola, Inc |
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44 / 48 page ![]() 44 MPC826xA (HiP4) Family Hardware Specifications MOTOROLA Package Description 1.5.2 Mechanical Dimensions Figure 15 provides the mechanical dimensions and bottom surface nomenclature of the 480 TBGA package. Figure 15. Mechanical Dimensions and Bottom Surface Nomenclature Dim Millimeters Min Max A 1.45 1.65 A1 0.60 0.70 A2 0.85 0.95 A3 0.25 — b 0.65 0.85 D 37.50 BSC D1 35.56 REF e 1.27 BSC E 37.50 BSC E1 35.56 REF Notes: 1. Dimensions and Tolerancing per ASME Y14.5M-1994. 2. Dimensions in millimeters. 3. Dimension b is measured at the maximum solder ball diameter, parallel to primary data A. 4. Primary data A and the seating plane are defined by the spherical crowns of the solder balls. |
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