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M24C02-DRMF3TP Arkusz danych(PDF) 34 Page - STMicroelectronics |
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M24C02-DRMF3TP Arkusz danych(HTML) 34 Page - STMicroelectronics |
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34 / 39 page ![]() Package mechanical data M24C02-A125 34/39 DocID025755 Rev 4 Figure 15. WFDFPN8 (MLP8) – 8-lead thin fine pitch dual flat package no lead 2 x 3 mm, package outline 1. Drawing is not to scale. 2. The central pad (the area E2 by D2 in the above illustration) must be either connected to Vss or left floating (not connected) in the end application. |
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