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SKY77433 Arkusz danych(PDF) 8 Page - Skyworks Solutions Inc. |
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SKY77433 Arkusz danych(HTML) 8 Page - Skyworks Solutions Inc. |
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8 / 11 page ![]() PRELIMINARY DATA SHEET SKY77433 FRONT-END MODULE FOR WCDMA / HSDPA / HSUPA TX (1920-1980 MHz), RX (2110-2170 MHz) Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 8 December 8, 2008 • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • 200595B Package Dimensions The SKY77433 is a multi-layer laminate base, overmold encapsulated modular package designed for surface-mounted solder attachment to a printed circuit board. Figure 4 is a mechanical drawing of the pad layout for this package. Figure 5 provides a recommended phone board layout footprint for the FEM to help the designer attain optimum thermal conductivity, good grounding, and minimum RF discontinuity for the 50 ohm terminals. Figure 4. Dimensional Diagram for 7 x 4 x 1.05 mm, 16-Pad Package (All Views) – SKY77433 |
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