SC1200 datasheet(2/60 Pages) TI

2 / 60 page

MSC1200

SBAS289E

www.ti.com

PACKAGE/ORDERING INFORMATION(1)

SPECIFIED

FLASH

PACKAGE

TEMPERATURE

PACKAGE

PRODUCT

MEMORY

PACKAGE-LEAD

DESIGNATOR

RANGE

MARKING

MSC1200Y2

TQFP-48

PFB

–40

°C to +85°C

MSC1200Y2

MSC1200Y3

TQFP-48

PFB

–40

°C to +85°C

MSC1200Y3

NOTE: (1) For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet, or refer to our web site at

www.ti.com/msc.

ABSOLUTE MAXIMUM RATINGS(1)

Analog Inputs

Input Current ............................................................ 100mA, Momentary

Input Current .............................................................. 10mA, Continuous

Input Voltage ............................................. AGND – 0.3V to AVDD + 0.3V

Power Supply

DVDD to DGND ...................................................................... –0.3V to 6V

AVDD to AGND ...................................................................... –0.3V to 6V

AGND to DGND .............................................................. –0.3V to +0.3V

VREF to AGND ....................................................... –0.3V to AVDD + 0.3V

Digital Input Voltage to DGND .............................. –0.3V to DVDD + 0.3V

Digital Output Voltage to DGND ........................... –0.3V to DVDD + 0.3V

Maximum Junction Temperature ................................................ +150

°C

Operating Temperature Range ...................................... –40

°C to +85°C

Storage Temperature Range ....................................... –65

°C to +150°C

Lead Temperature (soldering, 10s) ............................................ +235

°C

Package Power Dissipation ............................... (TJ Max – TAMBIENT)/θJA

Output Current All Pins ................................................................ 200mA

Output Pin Short Circuit ..................................................................... 10s

Thermal Resistance, Junction-to-Ambient

(

JA) ....................... 56.5°C/W

Thermal Resistance, Junction-to-Case (

JC) ........................... 12.8°C/W

Digital Outputs

Output Current ......................................................... 100mA, Continuous

I/O Source/Sink Current ............................................................... 100mA

Power Pin Maximum .................................................................... 300mA

NOTE: (1) Stresses beyond those listed under “Absolute Maximum Ratings”

may cause permanent damage to the device. Exposure to absolute-maximum-

rated conditions for extended periods may affect device reliability.

FEATURES(1)

MSC1200Y2(2)

MSC1200Y3(2)

Flash Program Memory (Bytes)

Up to 4k

Up to 8k

Flash Data Memory (Bytes)

Up to 2k

Up to 4k

Internal Scratchpad RAM (Bytes)

128

NOTES: (1) All peripheral features are the same on all devices; the flash

memory size is the only difference. (2) The last digit of the part number (N)

represents the onboard flash size = (2N)kBytes.

MSC1200Yx FAMILY FEATURES

ELECTRICAL CHARACTERISTICS: AVDD = 5V

All specifications from TMIN to TMAX, DVDD = +2.7V to 5.25V, fMOD = 15.625kHz, PGA = 1, Buffer ON, fDATA = 10Hz, Bipolar, and VREF ≡ (REF IN+) – (REF IN–) = +2.5V,

unless otherwise noted.

MSC1200Yx

PARAMETER

CONDITION

MIN

TYP

MAX

UNITS

ANALOG INPUT (AIN0-AIN7, AINCOM)

Analog Input Range

Buffer OFF

AGND – 0.1

AVDD + 0.1

Buffer ON

AGND + 50mV

AVDD – 1.5

Full-Scale Input Voltage Range

(In+) – (In–)

±V

REF/PGA

Differential Input Impedance

Buffer OFF

7/PGA

Ω

Input Current

Buffer ON

0.5

Bandwidth

Fast Settling Filter

–3dB

0.469 • fDATA

Sinc2 Filter

–3dB

0.318 • fDATA

Sinc3 Filter

–3dB

0.262 • fDATA

Programmable Gain Amplifier

User-Selectable Gain Ranges

128

Input Capacitance

Buffer ON

Input Leakage Current

Multiplexer Channel Off, T = +25

°C

0.5

Burnout Current Sources

Buffer ON

±2

µA

ADC OFFSET DAC

Offset DAC Range

±V

REF/(2 • PGA)

Offset DAC Monotonicity

Bits

Offset DAC Gain Error

±1.0

% of Range

Offset DAC Gain Error Drift

0.6

ppm/

°C

ELECTROSTATIC

DISCHARGE SENSITIVITY

This integrated circuit can be damaged by ESD. Texas Instru-

ments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling

and installation procedures can cause damage.

ESD damage can range from subtle performance degradation

to complete device failure. Precision integrated circuits may be

more susceptible to damage because very small parametric

changes could cause the device not to meet its published

specifications.

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