DIP20 datasheet(1/2 Pages) STMICROELECTRONICS

Numer części	DIP20

Szczegółowy opis	Thermal Data

PDF	2 Pages

Scroll/Zoom	100%

Producent	STMICROELECTRONICS [STMicroelectronics]

Strona internetowa	http://www.st.com

Logo

1 / 2 page

Thermal Data

DIP 20

item #

material

thickness

thermal

conductivity

leadframe

copper

0.25 mm

2.61 W/cm°C

die attach

epoxy glue

( silver glue )

10-40 µm

0.01 W/cm°C

molding

compound

epoxy resin

3 mm

0.0063W/cm°C

PACKAGE MATERIAL LIST

Typical assembly configuration before molding :

Charts enclosed :

1) Rth(j-a) vs power dissipation

2) Zth(j-a) vs time width and die size

February 1998

1/2

20 leads

®

Podobny numer części - DIP20

Producent	Numer części	Arkusz danych	Szczegółowy opis
Sensata Technologies, I...	DIP20-06-HPZ	90Kb / 2P	FRAMELESS BRUSHLESS DC (BLDC) MOTORS
	DIP20-06-HPZ	85Kb / 1P	FRAMELESS BRUSHLESS DC (BLDC) MOTORS Rev. 04/01/2024
	DIP20-09-HPZ	90Kb / 2P	FRAMELESS BRUSHLESS DC (BLDC) MOTORS
	DIP20-09-HPZ	85Kb / 1P	FRAMELESS BRUSHLESS DC (BLDC) MOTORS Rev. 04/01/2024
	DIP20-19-HPZ	90Kb / 2P	FRAMELESS BRUSHLESS DC (BLDC) MOTORS

Producent	Numer części	Arkusz danych	Szczegółowy opis
NTE Electronics	NTE8070	20Kb / 1P	Thermal Cutoff (Thermal Fuse)
Texas Instruments	UC1730	284Kb / 5P	Thermal Monitor
STMicroelectronics	DIP40	29Kb / 2P	Thermal Data Sep-1999
STMicroelectronics	DIP24	31Kb / 2P	Thermal Data Feb-1998
Advanced Micro Devices	ADA3200AEP5AP	186Kb / 24P	AMD Athlon 64 Processor Power and Thermal Data Sheet
STMicroelectronics	SDIP30	36Kb / 2P	SDIP30 Thermal Data Sep-1999
Advanced Micro Devices	ADA3200AEP5AP	738Kb / 95P	AMD Athlon??64 Processor Power and Thermal Data Sheet
KOA Speer Electronics, ...	ST3000	115Kb / 4P	thermal sensors
Panasonic Semiconductor	EYP-2MT098B	220Kb / 6P	Thermal Cutoffs (TCO)/ Thermal-Links
CUI Devices	SF100	234Kb / 2P	THERMAL PAD 08/05/2022