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DIP20 Arkusz danych(PDF) 2 Page - STMicroelectronics

Numer części DIP20
Szczegółowy opis  Thermal Data
PDF  2 Pages
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Producent  STMICROELECTRONICS [STMicroelectronics]
Strona internetowa  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

DIP20 Arkusz danych(HTML) 2 Page - STMicroelectronics

  DIP20 Datasheet HTML 1Page - STMicroelectronics DIP20 Datasheet HTML 2Page - STMicroelectronics  
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Thermal Data
DIP 20
2/2
1)
2)
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
2
2.2
2.4
60
80
100
120
dissipated power ( Watt )
Rth(j-a) (ºC/W)
floating in air
mounted on board
copper frame thickness = 0.25 mm
die pad = 125 x 160 sq.mils
die size = 10.000 sq.mils
0.001
0.01
0.1
1
10
100
1,000
1
2
3
5
10
20
30
50
100
Time or pulse width ( s )
Transient Thermal Resistance (ºC/W)
on die dissipating area = 2000 sq.mils
mounted on board
pd = 2 Watt
copper frame thickness = 0.25 mm
die pad = 110 x 120 sq.mils



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