ADRF5130

Data Sheet

Rev. A | Page 8 of 10

APPLICATIONS INFORMATION

Generate the evaluation PCB used in the application circuit

shown in Figure 11 with proper RF circuit design techniques.

Signal lines at the RF port must have a 50 Ω impedance, and the

package ground leads and backside ground slug must connect

directly to the ground plane, as shown in Figure 14.

13

GND

GND

RF1

GND

GND

GND

GND

14

GND

15

GND

16

RF2

17

GND

18

GND

C4

C7

C5

C8 TO C11

C12 TO C15

C6

R1

C1

C3

RF1

RF2

RFC

C2

C18 TO C21

1

3

4

2

5

6

Figure 11. Application Circuit

EVALUATION BOARD

The ADRF5130 evaluation board has eight metal layers and

dielectrics between each layer (see Figure 12). The top and the

bottom metal layers have copper thickness of 2 oz (2.7 mil),

whereas the metal layers in between them have 1 oz copper

(1.3 mil) thickness. The top dielectric material is 10 mil Rogers

RO4350, which exhibits a very low thermal coefficient, offering

control over thermal rise of the board. The dielectrics between

other metal layers are FR-4. The overall board thickness

achieved is 62 mil.

Figure 13 shows the top view of the ADRF5130 evaluation

board.

The top copper layer has all RF and dc traces, whereas the other

seven layers provide good ground and help to handle the thermal

rise on the evaluation board caused by the high power of the

ADRF5130. In addition, for proper thermal grounding, many

via holes are provided around the transmission lines and under

the exposed pad of the package. RF transmission lines on the

ADRF5130 evaluation board are coplanar wave guide design with

an 18 mil width and a ground spacing of 13 mil. For controlling

the thermal rise of the ADRF5130 evaluation board at high

temperatures and power levels, it is recommended to use a

heat sink and a mini dc fan.

W = 18mil

G = 13mil

T = 2.7mil

H = 10mil

2oz Cu (2.7mil)

RO4350 = 10mil

FR4

FR4

FR4

FR4

FR4

FR4

1oz Cu (1.3mil)

1oz Cu (1.3mil)

1oz Cu (1.3mil)

1oz Cu (1.3mil)

1oz Cu (1.3mil)

1oz Cu (1.3mil)

2oz Cu (2.7mil)

2oz Cu (2.7mil)

2oz Cu (2.7mil)

Figure 12. Evaluation Board Cross-Sectional View

1.500

0.050

0.050

Figure 13. Evaluation Board Top View