MPC855 datasheet(73/76 Pages) MOTOROLA

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MOTOROLA

MPC860 Family Hardware Speciﬁcations

Mechanical Dimensions of the PBGA Package

14.2 Mechanical Dimensions of the PBGA Package

For more information on the printed circuit board layout of the PBGA package, including

thermal via design and suggested pad layout, please refer to Motorola Application Note,

Plastic Ball Grid Array (order number: AN1231/D), available from your local Motorola

sales ofﬁce. Figure 14-75 shows the mechanical dimensions of the PBGA package.

Figure 14-75. Mechanical Dimensions and Bottom Surface Nomenclature

of the PBGA Package

SIDE VIEW

BOTTOM VIEW

18X

357X

TOP VIEW

0.3 M C

0.15 M C

0.2 C

0.2

0.25 C

0.35 C

NOTES:

1. Dimensions and tolerancing per ASME Y14.5M, 1994.

2. Dimensions in millimeters.

3. Dimension b is the maximum solder ball diameter

measured parallel to datum C.

DIM

MIN

MAX

MILLIMETERS

---

2.05

0.50

0.70

0.95

1.35

0.70

0.90

0.60

0.90

25.00 BSC

22.86 BSC

22.40

22.60

1.27 BSC

25.00 BSC

22.86 BSC

22.40

22.60

Case No. 1103-01

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