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FT234XD-R Arkusz danych(PDF) 31 Page - Future Technology Devices International Ltd. |
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FT234XD-R Arkusz danych(HTML) 31 Page - Future Technology Devices International Ltd. |
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31 / 37 page ![]() Copyright © 2015 Future Technology Devices International Limited 31 FT234XD USB TO BASIC UART IC Version 1.2 Document No.: FT_000753 Clearance No.: FTDI#324 9 Package Parameters The FT234XD is available in a DFN-12 package. The solder reflow profile is described in Section 9.2. 9.1 DFN-12 Package Mechanical Dimensions Figure 9.1 DFN-12 Package Dimensions The FT234XD is supplied in a RoHS compliant leadless DFN-12 package. The package is lead (Pb) free, and uses a ‘green’ compound. The package is fully compliant with European Union directive 2002/95/EC. This package is nominally 3.00mm x 3.00mm. The solder pads are on a 0.45mm pitch. The above mechanical drawing shows the DFN-12 package. Refer to the WDFN column in Figure 9.13. All dimensions are in millimetres. The centre pad on the base of the FT234XD is internally connected to ground. |
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