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STTS2004 Arkusz danych(PDF) 52 Page - STMicroelectronics |
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STTS2004 Arkusz danych(HTML) 52 Page - STMicroelectronics |
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52 / 58 page ![]() Package mechanical data STTS2004 52/58 DocID024229 Rev 3 The landing pattern recommendations per the JEDEC proposal for the TDFN package (DN) are shown in Figure 23. The preferred implementation with wide corner pads enhances device centering during assembly, but a narrower option is defined for modules with tight routing requirements. Figure 23. Landing pattern - TDFN8 package (DN) e/2 e/2 e2 K K E2/2 E2/2 E2 D2/2 D2 D2/2 L L e b b b2 b4 K2 K2 K2 E3 E3 e4 ai14000 |
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