STTS2004 datasheet(43/58 Pages) STMICROELECTRONICS

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STTS2004

Maximum ratings

Stressing the device above the ratings listed in the absolute maximum ratings table may

cause permanent damage to the device. These are stress ratings only and operation of the

device at these or any other conditions above those indicated in the operating sections of

this specification is not implied. Exposure to absolute maximum rating conditions for

extended periods may affect device reliability.

Table 28. Absolute maximum ratings

Symbol

Parameter

Value

Unit

TSTG

Storage temperature

–65 to 150

°C

TSLD(1)

1. Reflow at peak temperature of 260 °C. The time above 255 °C must not exceed 30 seconds.

Lead solder temperature for 10 seconds

260

°C

VIO

Input or output voltage

VSS – 0.3 to 10.0

others

VSS – 0.3 to 4.3

VDD

Supply voltage

VSS – 0.3 to 4.3

Output current

Power dissipation

320

JA

Thermal resistance

87.4

°C/W

STTS2004 Arkusz danych(PDF) 43 Page - STMicroelectronics