1

2

3

4

5

6

7

8

9

10

15

14

13

12

11

20

19

18

17

16

Top View

LEFTINM

LEFTINP

GND

RIGHTINP

RIGHTINM

HPRIGHT

VDD

GND

HPLEFT

CPVSS

TPA6133A2

www.ti.com

SLOS821B – JUNE 2013 – REVISED SEPTEMBER 2014

6 Pin Configuration and Functions

RTJ Package

(Top VIEW)

Pin Functions

PIN

INPUT,

OUTPUT,

DESCRIPTION

NAME

NUMBER

POWER

Left channel negative differential input. Impedance must be matched to LEFTINP. Connect the left

LEFTINM

1

I

input to LEFTINM when using single-ended inputs.

Left channel positive differential input. Impedance must be matched to LEFTINM. AC ground

LEFTINP

2

I

LEFTINP near signal source while maintaining matched impedance to LEFTINM when using single-

ended inputs.

Right channel positive differential input. Impedance must be matched to RIGHTINM. AC ground

RIGHTINP

4

I

RIGHTINP near signal source while maintaining matched impedance to RIGHTINM when using

single-ended inputs.

Analog ground. Must be connected to common supply GND. It is recommended that this pin be

GND

3, 9, 10, 13

P

Right channel negative differential input. Impedance must be matched to RIGHTINP. Connect the

RIGHTINM

5

I

right input to RIGHTINM when using single-ended inputs.

SD

6

I

Shutdown. Active low logic. 5V tolerant input.

TEST2

7

I

Factory test pins. Pull up to VDD supply. See Applications Diagram.

TEST1

8

I

Factory test pins. Pull up to VDD supply. See Applications Diagram.

HPRIGHT

11

O

Headphone light channel output. Connect to the right terminal of the headphone jack.

12

P

to analog ground (pin 13).

HPLEFT

14

O

Headphone left channel output. Connect to left terminal of headphone jack.

Negative supply generated by the charge pump. Decouple to pin 19 or a GND plane. Use a 1

μF

CPVSS

15, 16

P

capacitor.

CPN

17

P

Charge pump flying capacitor negative terminal. Connect one side of the flying capacitor to CPN.

CPP

18

P

Charge pump flying capacitor positive terminal. Connect one side of the flying capacitor to CPP.

Charge pump ground. GND must be connected to common supply GND. It is recommended that

GND

19

P

20

P

to GND (pin 19 ) with its own 1

μF capacitor.

Solder the thermal pad on the bottom of the QFN package to the GND plane of the PCB. It is

Thermal pad

Die Pad

P

required for mechanical stability and will enhance thermal performance.

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