TPA6133A2

SLOS821B – JUNE 2013 – REVISED SEPTEMBER 2014

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7 Specification

7.1 Absolute Maximum Ratings

(1)

MIN

MAX

UNIT

–0.3

6

V

CPVSS-0.2 V to minimum of

RIGHTINx, LEFTINx

(3.6 V, VDD+0.2 V)

Input voltage

SD, TEST1, TEST2

–0.3

7

V

Output continuous total power dissipation

See the Thermal Information Table

–40

85

°C

–40

150

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 Handling Ratings

MIN

MAX

UNIT

Storage temperature range

–65

150

°C

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all

–3

3

kV

Electrostatic discharge

Charged device model (CDM), per JEDEC specification

–750

750

V

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

MIN

MAX

UNIT

2.5

5.5

V

High-level input voltage

TEST1, TEST2, SD

1.3

V

Low-level input voltage

SD

0.35

V

Minimum Load Impedance

12.8

Ω

Operating free-air temperature

–40

85

°C

7.4 Thermal Information

RTJ

UNIT

20 PINS

Junction-to-ambient thermal resistance

34.8

Junction-to-case (top) thermal resistance

32.5

Junction-to-board thermal resistance

11.6

°C/W

Junction-to-top characterization parameter

0.4

Junction-to-board characterization parameter

11.6

Junction-to-case (bottom) thermal resistance

3.1

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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