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ST7FOXU0 Arkusz danych(PDF) 118 Page - STMicroelectronics |
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ST7FOXU0 Arkusz danych(HTML) 118 Page - STMicroelectronics |
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118 / 123 page ![]() Package characteristics ST7FOXU0 118/123 14 Package characteristics In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. |
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