DocID025979 Rev1

9/11

HSP051-4N10

Recommendation on PCB assembly

3.3

PCB design

1.

To control the solder paste amount, the closed via is recommended instead of open

vias.

2.

The position of tracks and open vias in the solder area should be well balanced. The

symmetrical layout is recommended, in case any tilt phenomena caused by

asymmetrical solder paste amount due to the solder flow away.

Figure 21. Printed circuit board layout recommendations

3.4

Reflow profile

Note:

Minimize air convection currents in the reflow oven to avoid component movement.

Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020.

250

0

50

100

150

200

240

210

180

150

120

90

60

30

300

270

-6°C/s

240-245 °C

2 - 3 °C/s

Temperature (°C)

-2 °C/s

-3 °C/s

Time (s)

0.9 °C/s

60 sec

(90 max)