AD6650SLASHPCB datasheet(11/45 Pages) AD

11 / 45 page

AD6650

Rev. A | Page 10 of 44

ABSOLUTE MAXIMUM RATINGS

Table 7.

Parameter

Rating

Supply Voltage

−0.3 V to +3.6 V

Input Voltage

−0.3 V to +3.6 V

Output Voltage Swing

−0.3 V to VDDIO + 0.3 V

Load Capacitance

200 pF

Junction Temperature Under Bias

125°C

Storage Temperature Range

−65°C to +150°C

Lead Temperature (5 sec)

280°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL CHARACTERISTICS

121-lead chip scale package ball grid array:

θJA = 22.8°C/W, no airflow, measurements made in the

horizontal position on a 4-layer board.

θJA = 20.2°C/W, 200 LFPM airflow, measurements made in the

horizontal position on a 4-layer board.

θJA = 20.7°C/W, no airflow, soldered on an 8-layer board with

two layers dedicated as ground planes.

ESD CAUTION

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