Features
Glass passivated chip .
1000 W peak pulse power capability with a 10/1000 us waveform .
Repetitive rate (duty cycle):0.01 % .
Very Fast response time: typically less than 1.0ps from 0V to VBR min
Excellent clamping capability .
For surface mounted applications in order to optimize board space .
High temperature soldering: 260℃/10s at terminals .
Plastic package has Underwriters Laboratory Flammability 94V-0 .
Halogen free and RoHS compliant .