ATECC508A datasheet(97/109 Pages) MICROCHIP

97 / 109 page

Microchip Technology Drawing No. C04-057-OA Rev D Sheet 2 of 2

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Foot Angle

0°

8°

15°

5°

Mold Draft Angle Bottom

15°

5°

Mold Draft Angle Top

0.51

0.31

Lead Width

0.25

0.17

Lead Thickness

1.27

0.40

Foot Length

0.50

0.25

Chamfer (Optional)

4.90 BSC

Overall Length

3.90 BSC

Molded Package Width

6.00 BSC

Overall Width

0.25

0.10

Standoff

1.25

Molded Package Thickness

1.75

Overall Height

1.27 BSC

Pitch

Number of Pins

MAX

NOM

MIN

Dimension Limits

MILLIMETERS

Units

protrusions shall not exceed 0.15mm per side.

3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. § Significant Characteristic

4. Dimensioning and tolerancing per ASME Y14.5M

Notes:

Footprint

1.04 REF

5. Datums A & B to be determined at Datum H.

8-Lead Plastic Small Outline - Narrow, 3.90 mm (.150 In.) Body [SOIC]

Atmel Legacy

ATECC508A

Package Drawings

Datasheet Complete

DS20005927A-page 97

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