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AFT05MP075N Arkusz danych(PDF) 3 Page - NXP Semiconductors |
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AFT05MP075N Arkusz danych(HTML) 3 Page - NXP Semiconductors |
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3 / 21 page ![]() AFT05MP075NR1 AFT05MP075GNR1 3 RF Device Data Freescale Semiconductor, Inc. Table 5. Electrical Characteristics (TA =25C unless otherwise noted) (continued) Characteristic Symbol Min Typ Max Unit Dynamic Characteristics (1) Reverse Transfer Capacitance (VDS = 12.5 Vdc 30 mV(rms)ac @ 1 MHz, VGS =0 Vdc) Crss — 2.3 — pF Output Capacitance (VDS = 12.5 Vdc 30 mV(rms)ac @ 1 MHz, VGS =0 Vdc) Coss — 64 — pF Input Capacitance (VDS = 12.5 Vdc, VGS =0 Vdc 30 mV(rms)ac @ 1 MHz) Ciss — 148 — pF Functional Tests (2) (In Freescale Test Fixture, 50 ohm system) VDD = 12.5 Vdc, IDQ(A+B) = 400 mA, Pin = 1 W,f= 520 MHz Common--Source Amplifier Output Power Pout — 70 — W Drain Efficiency D — 68.5 — % Load Mismatch/Ruggedness (In Freescale Test Fixture, 50 ohm system) IDQ(A+B) = 400 mA Frequency (MHz) Signal Type VSWR Pin (W) Test Voltage, VDD Result 520 CW > 65:1 at all Phase Angles 2 (3 dB Overdrive) 17 No Device Degradation 1. Each side of device measured separately. 2. Measurements made with device in straight lead configuration before any lead forming operation is applied. Lead forming is used for gull wing (GN) parts. |
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