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CC3235MODASF Arkusz danych(PDF) 85 Page - Texas Instruments

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Numer części CC3235MODASF
Szczegółowy opis  CC3235MODAx SimpleLink??Wi-Fi CERTIFIED??Dual-band Wireless MCU Module
PDF  100 Pages
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Producent  TI1 [Texas Instruments]
Strona internetowa  http://www.ti.com
Logo TI1 - Texas Instruments

CC3235MODASF Arkusz danych(HTML) 85 Page - Texas Instruments

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CC3235MODAS, CC3235MODASF
www.ti.com
SWRS233 – OCTOBER 2019
Submit Documentation Feedback
Product Folder Links: CC3235MODAS CC3235MODASF
Environmental Requirements and SMT Specifications
Copyright © 2019, Texas Instruments Incorporated
(1)
For details, refer to the solder paste manufacturer's recommendation.
8.6
Soldering and Reflow Condition
•
Heating method: Conventional convection or IR convection
•
Temperature measurement: Thermocouple d = 0.1 mm to 0.2 mm CA (K) or CC (T) at soldering
portion or equivalent method
•
Solder paste composition: SAC305
•
Allowable reflow soldering times: 2 times based on the reflow soldering profile (see Figure 8-1)
•
Temperature profile: Reflow soldering will be done according to the temperature profile (see
Figure 8-1)
•
Peak temperature: 260°C
Figure 8-1. Temperature Profile for Evaluation of Solder Heat Resistance of a Component
(at Solder Joint)
Table 8-1. Temperature Profile
Profile Elements
Convection or IR(1)
Peak temperature range
235 to 240°C typical (260°C maximum)
Pre-heat / soaking (150 to 200°C)
60 to 120 seconds
Time above melting point
60 to 90 seconds
Time with 5°C to peak
30 seconds maximum
Ramp up
< 3°C / second
Ramp down
< -6°C / second
NOTE
TI does not recommend the use of conformal coating or similar material on the SimpleLink™
module. This coating can lead to localized stress on the solder connections inside the
module and impact the module reliability. Use caution during the module assembly process
to the final PCB to avoid the presence of foreign material inside the module.



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