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CC3235MODASF Arkusz danych(PDF) 92 Page - Texas Instruments |
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CC3235MODASF Arkusz danych(HTML) 92 Page - Texas Instruments |
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92 / 100 page ![]() 92 CC3235MODAS, CC3235MODASF SWRS233 – OCTOBER 2019 www.ti.com Submit Documentation Feedback Product Folder Links: CC3235MODAS CC3235MODASF Mechanical, Packaging, and Orderable Information Copyright © 2019, Texas Instruments Incorporated 10 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. 10.1 Mechanical, Land, and Solder Paste Drawings NOTE The total height of the module is 2.4 mm. The weight of the CC3235MODAx module is 1.8 g typical. NOTE 1. All dimensions are in mm. 2. Solder mask should be the same or 5% larger than the dimension of the pad. 3. Solder paste must be the same as the pin for all peripheral pads. For ground pins, make the solder paste 20% smaller than the pad. 10.2 Package Option Addendum The CC3235MODAx is only offered in a 700-unit reel. |
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