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MPC852T Arkusz danych(PDF) 10 Page - Freescale Semiconductor, Inc

Numer części MPC852T
Szczegółowy opis  Hardware Specifications
PDF  80 Pages
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Producent  FREESCALE [Freescale Semiconductor, Inc]
Strona internetowa  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

MPC852T Arkusz danych(HTML) 10 Page - Freescale Semiconductor, Inc

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MPC852T Hardware Specifications, Rev. 3.1
10
Freescale Semiconductor
References
7.5 Experimental Determination
To determine the junction temperature of the device in the application after prototypes are available, the thermal
characterization parameter ( JT) can be used to determine the junction temperature with a measurement of the
temperature at the top center of the package case using the following equation:
TJ = TT +( JT x PD)
where:
JT = thermal characterization parameter
TT = thermocouple temperature on top of package
PD = power dissipation in package
The thermal characterization parameter is measured per JESD51-2 specification published by JEDEC using a
40-gauge type T thermocouple epoxied to the top center of the package case. The thermocouple should be positioned
so that the thermocouple junction rests on the package. A small amount of epoxy is placed over the thermocouple
junction and over about 1 mm of wire extending from the junction. The thermocouple wire is placed flat against the
package case to avoid measurement errors that cooling effects of the thermocouple wire cause.
8
References
Semiconductor Equipment and Materials International(415) 964-5111
805 East Middlefield Rd
Mountain View, CA 94043
MIL-SPEC and EIA/JESD (JEDEC) specifications800-854-7179 or
(Available from Global Engineering documents)303-397-7956
JEDEC Specifications http://www.jedec.org
1. C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an Automotive Engine
Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47-54.
2. B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal Resistance and Its
Application in Thermal Modeling,” Proceedings of SemiTherm, San Diego, 1999, pp. 212-220.
9
Power Supply and Power Sequencing
This section provides design considerations for the MPC852T power supply. The MPC852T has a core voltage
(VDDL) and PLL voltage (VDDSYN) that operates at a lower voltage than the I/O voltage VDDH. The I/O section of
the MPC852T is supplied with 3.3 V across VDDH and VSS (GND).
The signal PA[0:3], PA[8:11], PB15, PB[24:25]; PB[28:31], PC[4:7], PC[12:13], PC15] PD[3:15], TDI, TDO, TCK,
TRST, TMS, MII_TXEN, MII_MDIO are 5 V-tolerant. All inputs cannot be more than 2.5 V greater than VDDH. In
addition, 5 V-tolerant pins can not exceed 5.5 V, and remaining input pins cannot exceed 3.465 V. This restriction
applies to power-on reset or power down and normal operation.



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