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24CS512 Arkusz danych(PDF) 52 Page - Microchip Technology |
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24CS512 Arkusz danych(HTML) 52 Page - Microchip Technology |
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52 / 66 page ![]() 24CS512 DS20005769C-page 52 2018-2021 Microchip Technology Inc. Microchip Technology Drawing C04-091-OT Rev F Sheet 2 of 2 For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: c L L1 VIEW A-A SHEET 1 5-Lead Plastic Small Outline Transistor (OT) [SOT23] protrusions shall not exceed 0.25mm per side. 1. BSC: Basic Dimension. Theoretically exact value shown without tolerances. 2. Foot Angle Number of Pins Pitch Outside lead pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Footprint Lead Thickness Lead Width Notes: L1 b c Dimension Limits E E1 D L e1 A A2 A1 Units N e 0° 0.08 0.20 - - - 10° 0.26 0.51 MILLIMETERS 0.95 BSC 1.90 BSC 0.30 0.90 0.89 - 0.60 REF 2.90 BSC - 2.80 BSC 1.60 BSC - - - MIN 5 NOM 1.45 1.30 0.15 0.60 MAX REF: Reference Dimension, usually without tolerance, for information purposes only. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or Dimensioning and tolerancing per ASME Y14.5M |
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