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Zakładka z wyszukiwarką danych komponentów |
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Zakładka z wyszukiwarką danych komponentów |
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ST33TPHF2XSPI Arkusz danych(PDF) 21 Page - STMicroelectronics |
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ST33TPHF2XSPI Arkusz danych(HTML) 21 Page - STMicroelectronics |
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21 / 35 page  6.2 Thermal characteristics of packages The table below provides the thermal characteristics of the VFQFPN32 package. Table 13. Thermal characteristics Parameter Symbol Value Recommended operating temperature range Ambient temperature TA −40 to 105 °C Case temperature TC - Junction temperature TJ −43 to 108 °C Absolute maximum junction temperature - 125 °C Maximum power dissipation - 63 mW Theta-JA, -JB and -JC Junction to ambient thermal resistance θJA(1) 35.8 at 0 lfpm (2) Junction to case thermal resistance θJC 1.48 at 0 lfpm(2) Junction to board thermal resistance θJB 13.9 at 0 lfpm(2) 1. According to JESD51-2 (still air condition). 2. Linear feet per minute. ST33TPHF2XSPI Thermal characteristics of packages DS14186 - Rev 1 page 21/35 |
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