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MPC8560CPXAPDB Arkusz danych(PDF) 94 Page - Freescale Semiconductor, Inc |
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MPC8560CPXAPDB Arkusz danych(HTML) 94 Page - Freescale Semiconductor, Inc |
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94 / 108 page ![]() MPC8560 Integrated Processor Hardware Specifications, Rev. 3.1 94 Freescale Semiconductor Thermal the holes in the printed-circuit board and to locate them at the corners of the package. Figure 56 and Figure 57 provide exploded views of the plastic fence, heat sink, and spring clip. Figure 56. Exploded Views (1) of a Heat Sink Attachment using a Plastic Force |
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