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L6730TR Arkusz danych(PDF) 50 Page - STMicroelectronics |
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L6730TR Arkusz danych(HTML) 50 Page - STMicroelectronics |
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50 / 52 page ![]() Package mechanical data L6730 - L6730B 50/52 Table 13. HTSSOP20 mechanical data DIM. mm inch Min. Typ. Max. Min. Typ. Max. A 1.200 0.047 A1 0.150 0.006 A2 0.800 1.000 1.050 0.031 0.039 0.041 b 0.190 0.300 0.007 0.012 c 0.090 0.200 0.003 0.008 D (1) 1. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15mm per side. 6.400 6.500 6.600 0.252 0.256 0.260 D1(3) 2.200 0.087 E 6.200 6.400 6.600 0.244 0.252 0.260 E1 (2) 2. Dimension “E1” does not include interlead flash or protrusions. Intelead flash or protrusions shall not exceed 0.25mm per side. 4.300 4.400 4.500 0.170 0.173 0.177 E2 (3) 3. The size of exposed pad is variable depending of leadframe design pad size. End user should verify “D1” and “E2” dimensions for each device application. 1.500 0.059 e 0.650 0.025 L 0.450 0.600 0.750 0.018 0.024 0.030 L1 1.000 0.039 k 0° min., 8° max. aaa 0.100 0.004 Figure 44. Package dimensions |
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