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56F803 Arkusz danych(PDF) 2 Page - Freescale Semiconductor, Inc |
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56F803 Arkusz danych(HTML) 2 Page - Freescale Semiconductor, Inc |
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2 / 57 page ![]() Freescale Semiconductor, Inc. Datasheet Addendum © 2015 Freescale Semiconductor, Inc. All rights reserved. This addendum identifies changes to Rev.16 of the 56F803 datasheet. The changes described in this addendum have not been implemented in the specified pages. 1 Update the incomplete Thermal Design Considerations section Thermal Considerations section in 56F803 datasheet Rev.16 is incomplete. The complete Thermal Design Consideration section should be as follows: An estimation of the chip junction temperature, TJ, in °C can be obtained from the equation: TJ = TA + (PD x RJA) Eqn. 1 where: TA = ambient temperature °C RJA = package junction-to-ambient thermal resistance °C/W PD = power dissipation in package Historically, thermal resistance has been expressed as the sum of a junction-to-case thermal resistance and a case-to-ambient thermal resistance: RJA = RJC + RCA Eqn. 2 Location: Section 5.1, Page 51 Document Number: DSP56F803AD Rev. 0, 10/2015 Addendum to Rev. 16 of the 56F803 datasheet |
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