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MPC8250 Arkusz danych(PDF) 44 Page - Freescale Semiconductor, Inc |
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MPC8250 Arkusz danych(HTML) 44 Page - Freescale Semiconductor, Inc |
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44 / 60 page ![]() MPC8250 Hardware Specifications, Rev. 1 44 Freescale Semiconductor Pinout Figure 16 shows the side profile of the PBGA package to indicate the direction of the top surface view. Figure 16. Side View of the PBGA Package Table 21 shows the pinout list of the MPC8250VR. Table 20 defines conventions and acronyms used in Table 21. Table 21. MPC8250 VR Package Pinout List Pin Name Ball BR C16 BG D2 ABB/IRQ2 C1 TS D1 A0 D5 A1 E8 A2 C4 A3 B4 A4 A4 A5 D7 A6 D8 A7 C6 A8 B5 A9 B6 A10 C7 A11 C8 A12 A6 A13 D9 A14 F11 A15 B7 A16 B8 A17 C9 A18 A7 Die Transfer molding compound 1 mm pitch Wire bonds attach DIE Ball bond Screen-printed solder mask Cu substrate traces BT resin glass epoxy Plated substrate via |
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