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MPC8250 Arkusz danych(PDF) 55 Page - Freescale Semiconductor, Inc |
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MPC8250 Arkusz danych(HTML) 55 Page - Freescale Semiconductor, Inc |
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55 / 60 page ![]() MPC8250 Hardware Specifications, Rev. 1 Freescale Semiconductor 55 Package Description 5 Package Description The following sections provide the package parameters and mechanical dimensions. 5.1 Package Parameters Package parameters are provided in Table 22. THERMAL14 C23 I/O power E6, F6, H6, L5, L6, P6, T6, U6, V5, Y5, AA6, AA8, AA10, AA11, AA14, AA16, AA17, AB19, AB20, W21, U21, T21, P21, N21, M22, J22, H21, F21, F19, F17, E16, F14, E13, E12, F10, E10, E9 Core Power L3, V4, W3, AC11, AD11, AB15, U25, T24, J24, H25, F23, B19, D17, C17, D10, C10 Ground A2, B1, B2, A5, C5, C18, D4, D6, G2, L4, P1, R1, R4, AC4, AE7, AC23, Y25, N24, J23, A23, D23, D20, E18, A13, A16, K10, K11, K12, K13, K14, K15, K16, K17, L10, L11, L12, L13, L14, L15, L16, L17, M10, M11, M12, M13, M14, M15, M16, M17, N10, N11, N12, N13, N14, N15, N16, N17, P10, P11, P12, P13, P14, P15, P16, P17, R10, R11,R12, R13, R14, R15, R16, R17, T10, T11, T12, T13, T14, T15, T16, T17, U10, U11, U12, U13, U14, U15, U16, U17 1 The default configuration of the CPM pins (PA[0–31], PB[4–31], PC[0–31], PD[4–31]) is input. To prevent excessive DC current, it is recommended to either pull unused pins to GND or VDDH, or to configure them as outputs. 2 Must be pulled down or left floating. 3 If PCI is not desired, must be pulled up or left floating. 4 For information on how to use this pin, refer to MPC8260 PowerQUICC II Thermal Resistor Guide (AN2271/D). Table 22. Package Parameters Package Devices Outline (mm) Type Interconnects Pitch (mm) Nominal Unmounted Height (mm) ZU MPC8250 37.5 x 37.5 TBGA 480 1.27 1.55 VR MPC8250VR 27 x 27 PBGA 516 1 2.25 Table 21. MPC8250 VR Package Pinout List (continued) Pin Name Ball |
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