Data Sheet

ADRF5162

ABSOLUTE MAXIMUM RATINGS

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Rev. 0 | 5 of 11

For recommended operating conditions, see Table 1.

Table 2. Absolute Maximum Ratings

Parameter

Rating

Supply Voltage

Positive

−0.3 V to +3.6 V

Negative

−3.6 V to +0.3 V

Digital Control Input Voltage

Voltage

−0.3 V to VDD + 0.3 V

Current

3 mA

RF Input Power1 (f = 1 GHz to 5 GHz, TCASE = 85°C)

Insertion Loss Path

Average

46.0 dBm

Pulsed

49.0 dBm

Peak

50.5 dBm

Hot Switching

43.5 dBm

RF Power Under Unbiased Condition (VDD, VSS = 0 V)

Input at RFC

33 dBm

Input at RFx

27 dBm

Temperature

Junction (TJ)

135°C

Storage

−65°C to +150°C

Reflow

260°C

1 For power derating over frequency, see Figure 2 and Figure 3.

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

Only one absolute maximum rating can be applied at a time.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to PCB

thermal design is required.

θJC is the junction to the case bottom (channel to package bottom)

thermal resistance.

Table 3. Thermal Resistance

Package Type

θJC1

Unit

CP-24-22

8.6

°C/W

1 θJC was determined by simulation under the following conditions: the heat

transfer is due solely to the thermal conduction from the channel through the

ground pad to the PCB, and the ground pad is held constant at the operating

temperature of 85°C.

POWER DERATING CURVES

Figure 2. Power Derating vs. Frequency, Low Frequency Detail, TCASE = 85°C

Figure 3. Power Derating vs. Frequency, High Frequency Detail, TCASE = 85°C