SKY77171 • PRELIMINARY DATA SHEET

PA MODULE FOR WCDMA (1920-1980 MHZ)

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com

6

October 14, 2005 • Skyworks Proprietary and Confidential information. • Products and product information are subject to change without notice. • 200014P2

0.4

0.85 TYP

1.4

4.4

2.5

0.7

STENCIL APERTURE

TOP VIEW

APPROACH 1

0.4

0.85 TYP

0.25

4.4

METALLIZATION

TOP VIEW

0.7

0.5

0.6

0.85 TYP

2

4.5

3.5

0.8

SOLDER MASK OPENING

TOP VIEW

0.7

0.4

0.85 TYP

0.65

0.9

0.2

4.4

STENCIL APERTURE

TOP VIEW

APPRAOCH 2

Component

Outline

Thermal Via Array

Ø0.3 mm on 0.6 mm Pitch.

Additional Vias will improve

thermal performance.

NOTE: Thermal vias should

be tented and filled with

solder mask, 30–35 µm Cu

plating recommended.

200014_005

All dimensions are in millimeters.

Figure 5. Phone PCB Layout for 4 x 4 mm, 10-Pad Package – SKY77171