PA MODULE FOR WCDMA (1920-1980 MHZ)

SKY77171 • PRELIMINARY DATA SHEET

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com

200014P2 • Skyworks Proprietary and Confidential information. • Products and product information are subject to change without notice. • October 14, 2005

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Figure 6. Pad Names and Configuration (Top View)

200014_006

SKY77171-NN

SKY77171-NN

EXXXXX.XX

EXXXXX.XX

YYWW MEX

YYWW MEX

Revision

Number

Pin 1

Identifier

Lot

Number

Country

Code

Part

Number

Year of

Manufacture

Week

Package

Sealed

Figure 7. Typical Case Markings

Package and Handling Information

Because of its sensitivity to moisture absorption, this device

package is baked and vacuum-packed prior to shipment.

Instructions on the shipping container label must be followed

regarding exposure to moisture after the container seal is broken,

otherwise, problems related to moisture absorption may occur

when the part is subjected to high temperature during solder

assembly.

The SKY77171 is capable of withstanding an MSL3/250 °C solder

reflow. Care must be taken when attaching this product, whether

it is done manually or in a production solder reflow environment. If

the part is attached in a reflow oven, the temperature ramp rate

should not exceed 3 °C per second; maximum temperature should

not exceed 250 °C. If the part is manually attached, precaution

should be taken to insure that the part is not subjected to

temperatures exceeding 250 °C for more than 10 seconds. For

details on attachment techniques, precautions, and handling

procedures recommended by Skyworks, please refer to Skyworks

Application Note: PCB Design and SMT Assembly/Rework,

Document Number 101752. Additional information on standard

SMT reflow profiles can also be found in the JEDEC Standard

J-STD-020B.

Production quantities of this product are shipped in the standard

tape-and-reel format. For packaging details, refer to Skyworks

Application Note: Tape and Reel Information – RF Modules,

Document Number 101568.

Electrostatic Discharge Sensitivity

Discharge (ESD) immunity level for each non-ground pad of the

threshold level for each pad where the I-V curve between the pad

and ground starts to show degradation.

The ESD testing was performed in compliance with MIL-STD-883E

Method 3015.7 using the Human Body Model. If ESD damage

threshold magnitude is found to consistently exceed 2000 volts on

a given pad, this so is indicated. If ESD damage threshold below

2000 volts is measured for either polarity, numbers are indicated

that represent worst case values observed in product

characterization.

Various failure criteria can be utilized when performing ESD

testing. Many vendors employ relaxed ESD failure standards,

which fail devices only after “the pad fails the electrical

specification limits” or “the pad becomes completely

non-functional”. Skyworks employs most stringent criteria and

fails devices as soon as the pad begins to show any degradation

on a curve tracer.

To avoid ESD damage, both latent and visible, it is very important

that the product assembly and test areas follow the Class-1 ESD

Figure 8. ESD Sensitivity of Non-ground Pads (Top View)