LPC2917 datasheet(52/68 Pages) PHILIPS

52 / 68 page

LPC2917_19_1

Preliminary data sheet

Rev. 1.01 — 15 November 2007

52 of 68

NXP Semiconductors

LPC2917/19

ARM9 microcontroller with CAN and LIN

[1]

Based on package heat transfer, not device power consumption.

[2]

Peak current must be limited at 25 times average current.

[3]

For I/O Port 0, the maximum input voltage is defined by VI(ADC).

[4]

Only when VDD(IO) is present.

[5]

Note that pull-up should be off. With pull-up do not exceed 3.6 V.

[6]

In accordance with IEC 60747-1. An alternative definition of the virtual junction temperature is: Tvj =Tamb +Ptot × Rth(j-a) where Rth(j-a) is

a fixed value; see Section 10. The rating for Tvj limits the allowable combinations of power dissipation and ambient temperature.

[7]

Human-body model: discharging a 100 pF capacitor via a 10 k

Ω series resistor.

[8]

Machine model: discharging a 200 pF capacitor via a 0.75

μH series inductance and 10 Ω resistor.

[9]

112 mA per VDD(IO) or VSS(IO) should not be exceeded.

10. Thermal characteristics

IOHS

HIGH-state short-circuit

output current.

Drive HIGH, output shorted

to VSS(IO).

[9]

−33

IOLS

LOW-state short-circuit

output current.

Drive LOW, output shorted

to VDD(IO).

[9]

-+38

General

Tstg

Storage temperature.

−40

+150

°C

Tamb

Ambient temperature.

−40

+85

°C

Tvj

Virtual junction temperature.

[6]

−40

+125

°C

Memory

nendu(fl)

Endurance of flash memory.

100 000

cycle

tret(fl)

Flash memory retention

time.

-20

year

Electrostatic discharge

Vesd

Electrostatic discharge

voltage.

On all pins.

Human body model.

[7]

−2000

+2000

Machine model.

[8]

−200

+200

Charged device model.

−500

+500

On corner pins.

Charged device model.

-750

+750

Table 28.

Limiting values …continued

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Parameter

Conditions

Min

Max

Unit

Table 29.

Thermal characteristics

Symbol

Parameter

Conditions

Value

Unit

Rth(j-a)

thermal resistance from

junction to ambient

in free air

package;

LQFP144

K/W

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